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Solder Joint Fatigue Life by Thermomechanical Stress.
Article describes calculation, simulation and practical measuring fatique by thermomechanical stress in ceramic-FR4 3D construction....
JA - Elektronika a optoelektronika, elektrotechnika
- 2003 •
- D
Rok uplatnění
D - Stať ve sborníku
Design and Reliability of the Connection in 3D Electronic Systems
Theoretical study of properties for 3D electronic construction, world-known 3D electronoc connection, design 3D connection FR4-FR4, FR4-ceramic with respect to decrease thermomechanical stress, thermomecha...
JA - Elektronika a optoelektronika, elektrotechnika
- 2004 •
- Jx
Rok uplatnění
Jx - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)
Comparing of 2D and 3D Modeling of MSM
This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices - FR4 and ceramic material Al2O3. There are investigated combinations FR4-FR4,...
JA - Elektronika a optoelektronika, elektrotechnika
- 2005 •
- D
Rok uplatnění
D - Stať ve sborníku
FR4-Ceramic "Z" Axis Solder Interconnection
A special FR4-ceramic Z-axis connection was designed. A fatigue life measuring was realised on special apecimen. Solder joint fatique was measured for eutectic SnPb and LF SAC solder.The practical results were compared with the resu...
JA - Elektronika a optoelektronika, elektrotechnika
- 2004 •
- Jx
Rok uplatnění
Jx - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)
Šandera, Finite Element Based Solder Joint Fatigue Life Predictions for Same Stacked FR4 and Ceramic Substrate
This study explores the thermomechanical stresses of solder joint and solder joint fatigue life predictions calculated by finite elemement software ANSYS......
JA - Elektronika a optoelektronika, elektrotechnika
- 2003 •
- D
Rok uplatnění
D - Stať ve sborníku
FR4-ceramic "Z axis" solder joint reliability
Connection of ceramic and laminate substrates through z axis solder joint is describe...
JA - Elektronika a optoelektronika, elektrotechnika
- 2004 •
- D
Rok uplatnění
D - Stať ve sborníku
Mechanical Stress of Chip SMD Components with Ceramic Body
The reasons of thermomechanical stress SMD ceramic capacitor soldered on FR4 material are described in this paper. Simulation ANSYS program for FEM analyse is used....
JA - Elektronika a optoelektronika, elektrotechnika
- 2003 •
- D
Rok uplatnění
D - Stať ve sborníku
2D Modelling of Stresses in Solder Joint Connection
This paper describes thermomechanical modelling of connection of two different materials, which are often used in electronic devices ? organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic...
JA - Elektronika a optoelektronika, elektrotechnika
- 2004 •
- D
Rok uplatnění
D - Stať ve sborníku
Prototype of ridge optical waveguide on FR4 substrate for wavelengths 650 and 850 nm.
The optical planar waveguide used EpoCore polymer as core waveguide layer with thickness 50 µm with EpoClad cladding layer deposited onto FR4 (glass-fiber epoxy washer for PCBs) substrate. Additionally, the sample can be la...
Electrical and electronic engineering
- 2017 •
- Gprot
Rok uplatnění
Gprot - Prototyp
The Quality of BGA Solder Joint with Underfill
) of soldered BGA package with and without underfill on FR4 and Al2O3 carriers. BGA soldered on FR4 (ENIG) had higher value of shear strength than BGA soldered on alumina substrate with conductive thick film layer. Results ...
JA - Elektronika a optoelektronika, elektrotechnika
- 2016 •
- D
Rok uplatnění
D - Stať ve sborníku
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