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7D17003

PRINT3D CONTACTS

Public support

  • Provider

    Ministry of Education, Youth and Sports

  • Programme

    Eurostars

  • Call for proposals

    SMSM20177D003

  • Main participants

    ADVACAM s.r.o.

  • Contest type

    RP - Co-financing of EC programme

  • Contract ID

    MSMT-8179/2017-1

Alternative language

  • Project name in Czech

    PRINT3D CONTACTS

  • Annotation in Czech

    Vyhodnocení, vylepšení a demonstrování nové technologie pro tisk kovových čipů na desky plošných spojů chip to chip kontaktů. Výroba MediPix pixelové fotonové počítání radiačních detektorů, odolnější vůči mechanickým, tepelným a chemickým vlivům.Technologie se použijte pro vytvoření 3D sledovače částic, bude využito v kapesním detektoru záření v prostorovém a směrovém rozlišení.

Scientific branches

  • R&D category

    AP - Applied research

  • CEP classification - main branch

    AP - Municipal, regional and transportation planning

  • CEP - secondary branch

    BG - Nuclear, atomic and molecular physics, accelerators

  • CEP - another secondary branch

  • OECD FORD - equivalent branches <br>(according to the <a href="http://www.vyzkum.cz/storage/att/E6EF7938F0E854BAE520AC119FB22E8D/Prevodnik_oboru_Frascati.pdf">converter</a>)

    10304 - Nuclear physics<br>50702 - Urban studies (planning and development)<br>50703 - Transport planning and social aspects of transport (transport engineering to be 2.1)

Completed project evaluation

  • Provider evaluation

    V - Vynikající výsledky projektu (s mezinárodním významem atd.)

  • Project results evaluation

    The originally intended technology of printing direct contacts from the chip to the PCB proved to be problematic in practice on the part of the IMTEK partner for several reasons, therefore the scope of the project was extended by the development of three more contact technologies of chips. For all three, the feasibility was successfully demonstrated and a functional prototype was constructed, which passed the tests. In addition to production savings and improved connection properties, the newly developed contact technologies will enable a significantly better composition of multi-chip modules.

Solution timeline

  • Realization period - beginning

    May 1, 2017

  • Realization period - end

    Apr 30, 2020

  • Project status

    U - Finished project

  • Latest support payment

    Feb 26, 2020

Data delivery to CEP

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

  • Data delivery code

    CEP21-MSM-7D-U/01:1

  • Data delivery date

    Jun 22, 2021

Finance

  • Total approved costs

    13,744 thou. CZK

  • Public financial support

    6,872 thou. CZK

  • Other public sources

    6,872 thou. CZK

  • Non public and foreign sources

    0 thou. CZK