Low-cost and prototype-friendly method for biocompatible encapsulation of implantable electronics with epoxy overmolding, hermetic feedthroughs and P3HT coating

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00064173%3A_____%2F23%3A43925100" target="_blank" >RIV/00064173:_____/23:43925100 - isvavai.cz</a>

Alternative codes found

RIV/68407700:21460/23:00368655 RIV/00216208:11120/23:43925100 RIV/75010330:_____/23:00014228

Result on the web

<a href="https://doi.org/10.1038/s41598-023-28699-6" target="_blank" >https://doi.org/10.1038/s41598-023-28699-6</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1038/s41598-023-28699-6" target="_blank" >10.1038/s41598-023-28699-6</a>

Result language

angličtina

Original language name

Low-cost and prototype-friendly method for biocompatible encapsulation of implantable electronics with epoxy overmolding, hermetic feedthroughs and P3HT coating

Original language description

The research of novel implantable medical devices is one of the most attractive, yet complex areas in the biomedical field. The design and development of sufficiently small devices working in an in vivo environment is challenging but successful encapsulation of such devices is even more so. Industry-standard methods using glass and titanium are too expensive and tedious, and epoxy or silicone encapsulation is prone to water ingress with cable feedthroughs being the most frequent point of failure. This paper describes a universal and straightforward method for reliable encapsulation of circuit boards that achieves ISO10993 compliance. A two-part PVDF mold was machined using a conventional 3-axis machining center. Then, the circuit board with a hermetic feedthrough was placed in the mold and epoxy resin was injected into the mold under pressure to fill the cavity. Finally, the biocompatibility was further enhanced with an inert P3HT polymer coating which can be easily formulated into an ink. The biocompatibility of the encapsulants was assessed according to ISO10993. The endurance of the presented solution compared to silicone potting and epoxy potting was assessed by submersion in phosphate-buffered saline solution at 37 oC. The proposed method showed superior results to PDMS and simple epoxy potting.

Czech name

—

Czech description

—

Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

—

OECD FORD branch

30219 - Gastroenterology and hepatology

Project

<a href="/en/project/EF16_019%2F000860" target="_blank" >EF16_019/000860: International competitiveness of NIPH in research, development and education in alternative toxicological methods.</a><br>

Continuities

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2023

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Scientific Reports

ISSN

2045-2322

e-ISSN

2045-2322

Volume of the periodical

13

Issue of the periodical within the volume

January

Country of publishing house

GB - UNITED KINGDOM

Number of pages

16

Pages from-to

1644

UT code for WoS article

000984271700032

EID of the result in the Scopus database

2-s2.0-85147003186