Epoxy Mold Compound Encapsulation Concept for Large-Area Power Devices
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F22%3A00357884" target="_blank" >RIV/68407700:21230/22:00357884 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/TCPMT.2022.3160102" target="_blank" >https://doi.org/10.1109/TCPMT.2022.3160102</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/TCPMT.2022.3160102" target="_blank" >10.1109/TCPMT.2022.3160102</a>
Alternative languages
Result language
angličtina
Original language name
Epoxy Mold Compound Encapsulation Concept for Large-Area Power Devices
Original language description
A new concept for encapsulation of discrete bipolar high-power devices using Epoxy Mold Compound is demonstrated on silicon 4.5 kV press-pack fast recovery diodes with wafer diameter up to 130 mm and molybdenum pressure-release buffer up to 140 mm in diameter. The silicon wafers can be bonded to molybdenum disks using low-temperature bonding process or they can be fixed mechanically by the epoxy mold compound without direct bonding (free-floating). The encapsulated devices can be applied as housing-less or they can be inserted into hermetic ceramic housings with pole piece of 143 mm. The design aspects relevant for reliable operation are presented using multi-physics simulation in COMSOL. The summary of passed reliability tests including electrical testing in true application conditions demonstrates readiness of the concept for demanding applications in the temperature range up to 140 °C.
Czech name
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Czech description
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Classification
Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2022
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
IEEE Transactions on Components, Packaging and Manufacturing Technology
ISSN
2156-3950
e-ISSN
2156-3985
Volume of the periodical
12
Issue of the periodical within the volume
4
Country of publishing house
US - UNITED STATES
Number of pages
8
Pages from-to
602-609
UT code for WoS article
000803110300007
EID of the result in the Scopus database
2-s2.0-85126552994