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Local Thermophysical Properties Measurements on Polymers using Doped Silicon SThM Probe: Uncertainty Analysis and Interlaboratory Comparison

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00177016%3A_____%2F18%3AN0000062" target="_blank" >RIV/00177016:_____/18:N0000062 - isvavai.cz</a>

  • Alternative codes found

    RIV/00216305:26620/18:PU136355

  • Result on the web

    <a href="http://dx.doi.org/10.1109/THERMINIC.2018.8593308" target="_blank" >http://dx.doi.org/10.1109/THERMINIC.2018.8593308</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/THERMINIC.2018.8593308" target="_blank" >10.1109/THERMINIC.2018.8593308</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Local Thermophysical Properties Measurements on Polymers using Doped Silicon SThM Probe: Uncertainty Analysis and Interlaboratory Comparison

  • Original language description

    We first assess Scanning Thermal Microscopy (SThM) with a self-heated doped silicon nanoprobe as a method for the simultaneous identification of the local thermal conductivity and phase transition temperature of polymeric materials. In a second step, results of an interlaboratory comparison and an uncertainty analysis involving three laboratories applying the same protocol of phase transition temperature measurement allow evaluating the repeatability, the reproducibility and the reliability of the method.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    10302 - Condensed matter physics (including formerly solid state physics, supercond.)

Result continuities

  • Project

  • Continuities

    R - Projekt Ramcoveho programu EK

Others

  • Publication year

    2018

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings

  • ISBN

    978-1-5386-6759-0

  • ISSN

  • e-ISSN

  • Number of pages

    6

  • Pages from-to

  • Publisher name

  • Place of publication

  • Event location

    Stockholm, Švédsko

  • Event date

    Sep 26, 2018

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article