The Effect of Cu and Ni on the structure and properties of the IMC formed by the reaction of liquid Sn-Cu based solders with Cu substrate

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F09%3A00206338" target="_blank" >RIV/00216208:11320/09:00206338 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

The Effect of Cu and Ni on the structure and properties of the IMC formed by the reaction of liquid Sn-Cu based solders with Cu substrate

Original language description

The effect of Cu and Ni alloying elements on the morphology of the intermetallic compounds formed at the interface of the liquid Sn-Cu solder and the Cu substrate has been studied. At low Cu concentrations only a thin IMC layer is formed which remains almost unchanged in time and the substrate is dissolving quickly. Ni additions significantly accelerate the growth kinetics of the IMC layer, prevent the formation of a Cu3Sn layer and reduce the rate of substrate dissolution.

Czech name

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Czech description

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Type

J_x - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

CEP classification

BM - Solid-state physics and magnetism

OECD FORD branch

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Project

<a href="/en/project/1M0556" target="_blank" >1M0556: Eco-Centre for Applied Research of Non-Ferrous Metals</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year

2009

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Kovové materiály

ISSN

0023-432X

e-ISSN

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Volume of the periodical

47

Issue of the periodical within the volume

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Country of publishing house

SK - SLOVAKIA

Number of pages

5

Pages from-to

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UT code for WoS article

000267933100004

EID of the result in the Scopus database

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