Intermetallic compounds at the interface between SnCu(Ni) solders and Cu substrate

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F09%3A00206290" target="_blank" >RIV/00216208:11320/09:00206290 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Intermetallic compounds at the interface between SnCu(Ni) solders and Cu substrate

Original language description

Three Sn-Cu based lead-free solders, in particular the near eutectic Sn-0,7 wt.%Cu, the Sn-1,4 wt.%Cu and the alloy with Ni addition Sn-0,6 wt.%Cu-0,0wt.%Ni were used in this investigation to study the growth kinetics of the intermetallic compounds formed at the interface of the liquid Sn-Cu based solder and the Cu substrate. Cu and Ni influence significantly and in a different way both the morphology and the kinetics of IMC growt.

Czech name

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Czech description

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Type

J_x - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

CEP classification

BM - Solid-state physics and magnetism

OECD FORD branch

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Project

<a href="/en/project/1M0556" target="_blank" >1M0556: Eco-Centre for Applied Research of Non-Ferrous Metals</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year

2009

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

International Journal of Materials Research

ISSN

1862-5282

e-ISSN

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Volume of the periodical

100

Issue of the periodical within the volume

6

Country of publishing house

DE - GERMANY

Number of pages

4

Pages from-to

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UT code for WoS article

000267933300015

EID of the result in the Scopus database

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