Microstructure and Mechanical Properties of Lead-Free Solder Joints
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F15%3A10316376" target="_blank" >RIV/00216208:11320/15:10316376 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.12693/APhysPolA.128.750" target="_blank" >http://dx.doi.org/10.12693/APhysPolA.128.750</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.12693/APhysPolA.128.750" target="_blank" >10.12693/APhysPolA.128.750</a>
Alternative languages
Result language
angličtina
Original language name
Microstructure and Mechanical Properties of Lead-Free Solder Joints
Original language description
In this study we investigated the morphology and growth kinetics of the interfacial intermetallic compound layers formed between a Cu substrate and Sn-Cu based solders. We simulated the wave soldering process and subsequent ageing both at different temperatures and reaction times. The near eutectic Sn-0.7Cu alloy and Ni enriched Sn-0.7Cu-0.05Ni alloy were studied. Moreover, we measured the tensile strength of the simulated solder joints and analyzed fracture surfaces.
Czech name
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Czech description
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Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
BM - Solid-state physics and magnetism
OECD FORD branch
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Result continuities
Project
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Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2015
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Acta Physica Polonica A
ISSN
0587-4246
e-ISSN
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Volume of the periodical
128
Issue of the periodical within the volume
4
Country of publishing house
PL - POLAND
Number of pages
4
Pages from-to
750-753
UT code for WoS article
000366357300068
EID of the result in the Scopus database
2-s2.0-84950244563