Study of interaction between copper and melt of lead-free solders

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F13%3A86088412" target="_blank" >RIV/61989100:27360/13:86088412 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Study of interaction between copper and melt of lead-free solders
Original language description
Problems of reactive diffusion at the interface solid phase - melt were studied theoretically and experimentally. A theoretical description of the kinetics of dissolution of the solid phase in the melt will be presented for the case of planar dissolution. The main intention was to study experimentally the copper dissolution in melts of various solder alloys and the related reactive diffusion. We used pure Sn and Sn-Cu, Sn-Ag-Cu, Sn-Sb, Sn-Zn alloys as solder materials. Experiments aimed at the study ofa Cu plate dissolving in the solder melt were carried out at various conditions. Concentration profiles of elements and thickness of layers of phases were determined by SEM and X-ray microanalyses (WDX, EDX) of specimens after their heating.
Czech name
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Czech description
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Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JG - Metallurgy, metal materials
OECD FORD branch
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Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2013
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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