All

What are you looking for?

All
Projects
Results
Organizations

Quick search

  • Projects supported by TA ČR
  • Excellent projects
  • Projects with the highest public support
  • Current projects

Smart search

  • That is how I find a specific +word
  • That is how I leave the -word out of the results
  • “That is how I can find the whole phrase”

Reactive Diffusion at the Contact of a Solid Phase with the Solder Melt

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F12%3A86084322" target="_blank" >RIV/61989100:27360/12:86084322 - isvavai.cz</a>

  • Result on the web

    <a href="http://dx.doi.org/10.4028/www.scientific.net/DDF.322.41" target="_blank" >http://dx.doi.org/10.4028/www.scientific.net/DDF.322.41</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.4028/www.scientific.net/DDF.322.41" target="_blank" >10.4028/www.scientific.net/DDF.322.41</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Reactive Diffusion at the Contact of a Solid Phase with the Solder Melt

  • Original language description

    Problems of reactive diffusion at the solid phase and melt contact are studied theoretically. The rate constant is a fundamental parameter characterizing the dissolving rate at a certain configuration of experiment. Relationships between the solid phasedissolving rate, i.e. the solid phase interface boundary movement in the melt, and rates of growth of intermetallic phases in the metal (Cu) are observed. This procedure enables the creation of surface and subsurface layers of regulated thickness in metallic materials by means of reactive diffusion. The main intention was an experimental study of copper dissolving in melts of various solder alloys and the related reactive diffusion. We used Sn, Sn?Cu, Sn?Ag?Cu, Sn?Zn and Sn?In alloys as a solder material. The problems that need to be solved preferentially are emphasized. It concerns especially the determination of the rate constant of dissolving and verifying whether the proposed model equations can be used for this constant determinati

  • Czech name

  • Czech description

Classification

  • Type

    J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

  • CEP classification

    JG - Metallurgy, metal materials

  • OECD FORD branch

Result continuities

  • Project

    <a href="/en/project/OC08032" target="_blank" >OC08032: Theoretical and experimental study of phase equilibria in solder materials for high-temperature applications</a><br>

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>Z - Vyzkumny zamer (s odkazem do CEZ)

Others

  • Publication year

    2012

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    Defect and Diffusion Forum

  • ISSN

    1012-0386

  • e-ISSN

  • Volume of the periodical

    322

  • Issue of the periodical within the volume

    Neuveden

  • Country of publishing house

    CH - SWITZERLAND

  • Number of pages

    32

  • Pages from-to

    41-72

  • UT code for WoS article

  • EID of the result in the Scopus database