Reactive Diffusion at the Contact of a Solid Phase with the Solder Melt
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F12%3A86084322" target="_blank" >RIV/61989100:27360/12:86084322 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.4028/www.scientific.net/DDF.322.41" target="_blank" >http://dx.doi.org/10.4028/www.scientific.net/DDF.322.41</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.4028/www.scientific.net/DDF.322.41" target="_blank" >10.4028/www.scientific.net/DDF.322.41</a>
Alternative languages
Result language
angličtina
Original language name
Reactive Diffusion at the Contact of a Solid Phase with the Solder Melt
Original language description
Problems of reactive diffusion at the solid phase and melt contact are studied theoretically. The rate constant is a fundamental parameter characterizing the dissolving rate at a certain configuration of experiment. Relationships between the solid phasedissolving rate, i.e. the solid phase interface boundary movement in the melt, and rates of growth of intermetallic phases in the metal (Cu) are observed. This procedure enables the creation of surface and subsurface layers of regulated thickness in metallic materials by means of reactive diffusion. The main intention was an experimental study of copper dissolving in melts of various solder alloys and the related reactive diffusion. We used Sn, Sn?Cu, Sn?Ag?Cu, Sn?Zn and Sn?In alloys as a solder material. The problems that need to be solved preferentially are emphasized. It concerns especially the determination of the rate constant of dissolving and verifying whether the proposed model equations can be used for this constant determinati
Czech name
—
Czech description
—
Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JG - Metallurgy, metal materials
OECD FORD branch
—
Result continuities
Project
<a href="/en/project/OC08032" target="_blank" >OC08032: Theoretical and experimental study of phase equilibria in solder materials for high-temperature applications</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Defect and Diffusion Forum
ISSN
1012-0386
e-ISSN
—
Volume of the periodical
322
Issue of the periodical within the volume
Neuveden
Country of publishing house
CH - SWITZERLAND
Number of pages
32
Pages from-to
41-72
UT code for WoS article
—
EID of the result in the Scopus database
—