All

What are you looking for?

All
Projects
Results
Organizations

Quick search

  • Projects supported by TA ČR
  • Excellent projects
  • Projects with the highest public support
  • Current projects

Smart search

  • That is how I find a specific +word
  • That is how I leave the -word out of the results
  • “That is how I can find the whole phrase”

Reactive diffusion upon planar dissolving of copper in solder melts

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F11%3A86081171" target="_blank" >RIV/61989100:27360/11:86081171 - isvavai.cz</a>

  • Result on the web

    <a href="http://dx.doi.org/10.4028/www.scientific.net/DDF.309-310.127" target="_blank" >http://dx.doi.org/10.4028/www.scientific.net/DDF.309-310.127</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.4028/www.scientific.net/DDF.309-310.127" target="_blank" >10.4028/www.scientific.net/DDF.309-310.127</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Reactive diffusion upon planar dissolving of copper in solder melts

  • Original language description

    Problems of reactive diffusion at a solid phase - melt contact were studied theoretically. The main intention was to calculate the time course of the solid phase dissolving in the case of planar dissolving. A theoretical description of the kinetics of solid phase dissolving in the melt will be presented for the case of planar dissolving. The aim is to derive a relation for the interphase boundary movement depending on time and a time course of growth of the element A concentration in the melt B. The main intention was to study experimentally the copper dissolving in melts of various solder alloys and the related reactive diffusion. We used pure Sn and Sn-Cu, Sn-Ag-Cu, Sn-Sb, Sn-Zn alloys as solder materials. Experiments aimed at the study of a Cu platedissolving in the solder melt were carried out at various selected temperatures and times. The problems of reactive diffusion were studied both theoretically and experimentally and the problems that have to be solved preferably were emph

  • Czech name

  • Czech description

Classification

  • Type

    J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

  • CEP classification

    JG - Metallurgy, metal materials

  • OECD FORD branch

Result continuities

  • Project

    <a href="/en/project/OC08032" target="_blank" >OC08032: Theoretical and experimental study of phase equilibria in solder materials for high-temperature applications</a><br>

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>Z - Vyzkumny zamer (s odkazem do CEZ)

Others

  • Publication year

    2011

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    Defect and Diffusion Forum

  • ISSN

    1012-0386

  • e-ISSN

  • Volume of the periodical

    309-310

  • Issue of the periodical within the volume

  • Country of publishing house

    CH - SWITZERLAND

  • Number of pages

    6

  • Pages from-to

    127-134

  • UT code for WoS article

    000291709300014

  • EID of the result in the Scopus database