Reactive diffusion upon planar dissolving of copper in solder melts
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F11%3A86081171" target="_blank" >RIV/61989100:27360/11:86081171 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.4028/www.scientific.net/DDF.309-310.127" target="_blank" >http://dx.doi.org/10.4028/www.scientific.net/DDF.309-310.127</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.4028/www.scientific.net/DDF.309-310.127" target="_blank" >10.4028/www.scientific.net/DDF.309-310.127</a>
Alternative languages
Result language
angličtina
Original language name
Reactive diffusion upon planar dissolving of copper in solder melts
Original language description
Problems of reactive diffusion at a solid phase - melt contact were studied theoretically. The main intention was to calculate the time course of the solid phase dissolving in the case of planar dissolving. A theoretical description of the kinetics of solid phase dissolving in the melt will be presented for the case of planar dissolving. The aim is to derive a relation for the interphase boundary movement depending on time and a time course of growth of the element A concentration in the melt B. The main intention was to study experimentally the copper dissolving in melts of various solder alloys and the related reactive diffusion. We used pure Sn and Sn-Cu, Sn-Ag-Cu, Sn-Sb, Sn-Zn alloys as solder materials. Experiments aimed at the study of a Cu platedissolving in the solder melt were carried out at various selected temperatures and times. The problems of reactive diffusion were studied both theoretically and experimentally and the problems that have to be solved preferably were emph
Czech name
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Czech description
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Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JG - Metallurgy, metal materials
OECD FORD branch
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Result continuities
Project
<a href="/en/project/OC08032" target="_blank" >OC08032: Theoretical and experimental study of phase equilibria in solder materials for high-temperature applications</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Defect and Diffusion Forum
ISSN
1012-0386
e-ISSN
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Volume of the periodical
309-310
Issue of the periodical within the volume
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Country of publishing house
CH - SWITZERLAND
Number of pages
6
Pages from-to
127-134
UT code for WoS article
000291709300014
EID of the result in the Scopus database
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