Reactive diffusion upon planar dissolving of copper in solder melts

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F11%3A86081171" target="_blank" >RIV/61989100:27360/11:86081171 - isvavai.cz</a>

Result on the web

<a href="http://dx.doi.org/10.4028/www.scientific.net/DDF.309-310.127" target="_blank" >http://dx.doi.org/10.4028/www.scientific.net/DDF.309-310.127</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.4028/www.scientific.net/DDF.309-310.127" target="_blank" >10.4028/www.scientific.net/DDF.309-310.127</a>

Result language

angličtina

Original language name

Reactive diffusion upon planar dissolving of copper in solder melts

Original language description

Problems of reactive diffusion at a solid phase - melt contact were studied theoretically. The main intention was to calculate the time course of the solid phase dissolving in the case of planar dissolving. A theoretical description of the kinetics of solid phase dissolving in the melt will be presented for the case of planar dissolving. The aim is to derive a relation for the interphase boundary movement depending on time and a time course of growth of the element A concentration in the melt B. The main intention was to study experimentally the copper dissolving in melts of various solder alloys and the related reactive diffusion. We used pure Sn and Sn-Cu, Sn-Ag-Cu, Sn-Sb, Sn-Zn alloys as solder materials. Experiments aimed at the study of a Cu platedissolving in the solder melt were carried out at various selected temperatures and times. The problems of reactive diffusion were studied both theoretically and experimentally and the problems that have to be solved preferably were emph

Czech name

—

Czech description

—

Type

J_x - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

CEP classification

JG - Metallurgy, metal materials

OECD FORD branch

—

Project

<a href="/en/project/OC08032" target="_blank" >OC08032: Theoretical and experimental study of phase equilibria in solder materials for high-temperature applications</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year

2011

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Defect and Diffusion Forum

ISSN

1012-0386

e-ISSN

—

Volume of the periodical

309-310

Issue of the periodical within the volume

—

Country of publishing house

CH - SWITZERLAND

Number of pages

6

Pages from-to

127-134

UT code for WoS article

000291709300014

EID of the result in the Scopus database

—