Reactive diffusion at the cylindrical dissolving of copper in the solder melt

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F11%3A86081197" target="_blank" >RIV/61989100:27360/11:86081197 - isvavai.cz</a>

Result on the web

<a href="http://dx.doi.org/10.4028/www.scientific.net/DDF.312-315.387" target="_blank" >http://dx.doi.org/10.4028/www.scientific.net/DDF.312-315.387</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.4028/www.scientific.net/DDF.312-315.387" target="_blank" >10.4028/www.scientific.net/DDF.312-315.387</a>

Result language

angličtina

Original language name

Reactive diffusion at the cylindrical dissolving of copper in the solder melt

Original language description

Problems of reactive diffusion at the solid phase and melt contact were studied theoretically and experimentally. The main intention was to calculate the time course of the solid phase dissolving in the case of cylindrical dissolving. These calculationswere carried out on the assumption for the rate constant of dissolving K = const. In our work we give heed especially to the dominating process, which is the solid metal A dissolved in the melt B. During the dissolving the melt B saturates with the metalA and the process is influenced by convections which are characteristic for the given experimental configuration. A theoretical description of the kinetics of the solid phase dissolving in the melt will be presented for the case of cylindrical dissolving. The aim is to derive a relation for the interface boundary movement c(t) in dependence on time and a time course of growth of the element A concentration in the melt B. There are problems with accurate determination of the interface bo

Czech name

—

Czech description

—

Type

J_x - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

CEP classification

JG - Metallurgy, metal materials

OECD FORD branch

—

Project

<a href="/en/project/OC08032" target="_blank" >OC08032: Theoretical and experimental study of phase equilibria in solder materials for high-temperature applications</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year

2011

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Defect and Diffusion Forum

ISSN

1012-0386

e-ISSN

—

Volume of the periodical

312-315

Issue of the periodical within the volume

—

Country of publishing house

CH - SWITZERLAND

Number of pages

6

Pages from-to

387-392

UT code for WoS article

000297606300066

EID of the result in the Scopus database

—