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Thermal analysis of selected tin-based lead-free solder alloys

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216224%3A14310%2F09%3A00037461" target="_blank" >RIV/00216224:14310/09:00037461 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Thermal analysis of selected tin-based lead-free solder alloys

  • Original language description

    The Sn-Ag-Cu alloys have favourable solderability and wetting properties and are, therefore, being considered as potential lead-free solder materials. In the present study, tin-based Sn-Ag-Cu and Sn-Ag-Cu-Bi alloys were studied in detail by a differential scanning calorimetry (DSC) and thermodynamic calculations using the CALPHAD approach. The amount of the alloying elements in the materials was chosen to be close to the respective eutectic composition and the nominal compositions were the following: Sn-3.7Ag-0.7Cu, Sn-1.0Ag-0.5Cu-1Bi (in wt.%). Thermal effects during melting and solidifying were experimentally studied by the DSC technique. The microstructure of the samples was determined by the light microscopy and the composition of solidified phaseswas obtained by the energy-dispersive X-ray spectroscopy, respectively. The solidification behaviour under equilibrium conditions was simulated using the Thermo-Calc software package.

  • Czech name

  • Czech description

Classification

  • Type

    J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

  • CEP classification

    BM - Solid-state physics and magnetism

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    Z - Vyzkumny zamer (s odkazem do CEZ)

Others

  • Publication year

    2009

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    Kovové materiály

  • ISSN

    0023-432X

  • e-ISSN

  • Volume of the periodical

    47

  • Issue of the periodical within the volume

    1

  • Country of publishing house

    SK - SLOVAKIA

  • Number of pages

    8

  • Pages from-to

  • UT code for WoS article

    000267933100007

  • EID of the result in the Scopus database