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Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F19%3A10242426" target="_blank" >RIV/61989100:27360/19:10242426 - isvavai.cz</a>

  • Result on the web

    <a href="https://www.emerald.com/insight/content/doi/10.1108/SSMT-10-2018-0039/full/html" target="_blank" >https://www.emerald.com/insight/content/doi/10.1108/SSMT-10-2018-0039/full/html</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1108/SSMT-10-2018-0039" target="_blank" >10.1108/SSMT-10-2018-0039</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder

  • Original language description

    Purpose This study aims to solder AlN ceramics with a Cu substrate using an active type Sn-Ag-Ti solder. Soldering was performed with power ultrasound. The Sn3.5Ag2Ti alloy was first studied. Design/methodology/approach It was found to contain a Sn matrix, where both Ag phase - e-Ag3Sn - and Ti phases e-Ti6Sn5 and Ti2Sn3 - were identified. Ti contained in these phases is distributed to the interface with ceramic material. A reaction layer was thus formed. This layer varies in thickness from 0.5 to 3.5 mu m and ensures the wettability of an active solder on the surfaces of ceramic materials. Findings X-ray diffraction analysis proved the presence of new NTi and AlTi2 phases on the fractured surface. Sn plays the main role in bond formation when soldering the Cu substrate with Sn-Ag-Ti solder. The Cu3Sn and Cu6Sn5 phases, which grow in direction from the phase interface to solder matrix, were found in all cases within the solder/Cu substrate interface. The combination of AlN ceramics/Cu joint maintained a shear strength of 29.5 MPa, whereas the Cu/Cu joint showed a somewhat higher shear strength of 39.5 MPa. Originality/value The present study was oriented towards soldering of AlN ceramics with a Cu substrate by the aid of ultrasound, and the fluxless soldering method was applied. Soldering alloy type Sn-Ag-Ti was analysed, and the interactions between the solder and ceramic and/or Cu substrate were studied. The shear strength of fabricated soldered joints was measured.

  • Czech name

  • Czech description

Classification

  • Type

    J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database

  • CEP classification

  • OECD FORD branch

    20500 - Materials engineering

Result continuities

  • Project

  • Continuities

    I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Others

  • Publication year

    2019

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    Soldering &amp; Surface Mount Technology

  • ISSN

    0954-0911

  • e-ISSN

  • Volume of the periodical

    31

  • Issue of the periodical within the volume

    2

  • Country of publishing house

    GB - UNITED KINGDOM

  • Number of pages

    9

  • Pages from-to

    93-101

  • UT code for WoS article

    000464744600003

  • EID of the result in the Scopus database