Characterization of Sn-Sb-Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu-SiC Metal-Ceramic Composite

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F21%3A10248627" target="_blank" >RIV/61989100:27360/21:10248627 - isvavai.cz</a>

Result on the web

<a href="https://www.mdpi.com/1996-1944/14/21/6369" target="_blank" >https://www.mdpi.com/1996-1944/14/21/6369</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3390/ma14216369" target="_blank" >10.3390/ma14216369</a>

Result language

angličtina

Original language name

Characterization of Sn-Sb-Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu-SiC Metal-Ceramic Composite

Original language description

The aim of this research was to characterize soldering alloys of the type Sn-Sb-Ti and to study the ultrasonic soldering of SiC ceramics with a metal-ceramic composite of the type Cu-SiC. The Sn5Sb3Ti solder exerts a thermal transformation of a peritectic character with an approximate melting point of 234 &amp; DEG;C and a narrow melting interval. The solder microstructure consists of a tin matrix, where the acicular constituents of the Ti-6(Sb,Sn)(5) phase and the sharp-edged constituents of the TiSbSn phase are precipitated. The tensile strength of the soldering alloy depends on the Ti content and reaches values from 34 to 51 MPa. The average strength of the solder increases with increasing Ti content. The bond with SiC ceramics is formed owing to the interaction of titanium, activated by ultrasound, with SiC ceramics, forming the (Ti,Si)(6)(Sb,Sn)(5) reaction product. The bond with the metal-ceramic composite Cu-SiC is formed owing to the solubility of Cu in a tin solder forming two phases: the wettable eta-Cu6Sn5 phase, formed in contact with the solder, and the non-wettable epsilon-Cu3Sn phase, formed in contact with the copper composite. The average shear strength of the combined joint of SiC/Cu-SiC fabricated using the Sn5Sb3Ti solder was 42.5 MPa. The Sn-Sb-Ti solder is a direct competitor of the S-Bond active solder. The production of solders is cheaper, and the presence of antimony increases their strength. In addition, the application temperature range is wider.

Czech name

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Czech description

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Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

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OECD FORD branch

20500 - Materials engineering

Project

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Continuities

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2021

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Materials

ISSN

1996-1944

e-ISSN

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Volume of the periodical

14

Issue of the periodical within the volume

21

Country of publishing house

CH - SWITZERLAND

Number of pages

22

Pages from-to

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UT code for WoS article

000719083000001

EID of the result in the Scopus database

2-s2.0-85118264158