Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F14%3A10271598" target="_blank" >RIV/00216208:11320/14:10271598 - isvavai.cz</a>

Alternative codes found

RIV/68407700:21230/14:00221207

Result on the web

<a href="http://dx.doi.org/10.1007/s11664-014-3121-6" target="_blank" >http://dx.doi.org/10.1007/s11664-014-3121-6</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1007/s11664-014-3121-6" target="_blank" >10.1007/s11664-014-3121-6</a>

Result language

angličtina

Original language name

Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints

Original language description

Undercooling and recalescence were studied using the differential scanning calorimetry (DSC) method on real electronic systems. Two solder pastes, Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5, were used for preparation of electronic joints. Various combinations ofthese solders and soldering pads with different surface finishes such as Cu, Cu-Ni-Au, Cu-Sn, and Cu-Sn99Cu1 were used. During melting of both pastes, the Sn and Sn99Cu1 surface finishes immediately dissolved in the solder and the Cu surface coating wasexposed to the melt. Therefore, practically the same undercooling was found for the Cu, Cu-Sn, and Cu-Sn99Cu1 coatings. The lowest undercooling was found for the Cu-Ni-Au surface finish for both solder pastes. If two separated electronic joints were made on the sample, two separate peaks were found in the DSC signal during solidification. In the sample with only one joint, only one exothermic peak was found. These findings were observed for all paste/surface finish combinations. These d

Czech name

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Czech description

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Type

J_x - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

CEP classification

BM - Solid-state physics and magnetism

OECD FORD branch

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Project

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Continuities

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2014

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Journal of Electronic Materials

ISSN

0361-5235

e-ISSN

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Volume of the periodical

43

Issue of the periodical within the volume

7

Country of publishing house

US - UNITED STATES

Number of pages

8

Pages from-to

2479-2486

UT code for WoS article

000336796700003

EID of the result in the Scopus database

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