Effect of non-standard SnAg surface finishes on properties of solder joints

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F23%3A00370276" target="_blank" >RIV/68407700:21230/23:00370276 - isvavai.cz</a>

Result on the web

<a href="https://doi.org/10.1016/j.apsadv.2023.100483" target="_blank" >https://doi.org/10.1016/j.apsadv.2023.100483</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.apsadv.2023.100483" target="_blank" >10.1016/j.apsadv.2023.100483</a>

Result language

angličtina

Original language name

Effect of non-standard SnAg surface finishes on properties of solder joints

Original language description

In this study, the effects of nonstandard near-eutectic SnAg surfaces on the wettability, intermetallic compound growth and mechanical properties of solder joints were investigated. Four types of surface finishes based on near eutectic SnAg alloys with different compositions and numbers of layers were analyzed. Design/methodology/approach: The effect of surface-finishes SnAg5NiP and SnAg7NiP, which were prepared with and without a Ni-P diffusion barrier, was tested. The Ni-P layer was produced either chemically or electrochemically. The effect of the SnAg surface finish on wettability, formation, and growth of intermetallic compound in the solder joint was analyzed. We further explored the impact of different PCB finishes on the quality of soldered joints. This investigation involved a comparative analysis of the behavior of SnAg finishes in comparison to pure copper, as well as the commonly employed HASL, ENIG, and ImSn finishes.Findings: It was found that SnAg surface finishes with a Ni-P diffusion barrier are wetted by molten solder faster than surface finishes without a diffusion barrier. The mechanical properties of the joints on both surfaces are comparable to those on ENIG. SnAg that include a chemically created Ni-P diffusion layer is characterized by the formation of more thermally stable ternary intermetallic compounds based on (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4. On the contrary, the electrochemically formed Ni layer supports the increase in the rate of intermetallic compound formation, which affects the properties of the soldered joints.Originality: Nonstandard near-eutectic SnAg finishes, which contains a Ni-P diffusion layer can be used as promising replacement of ENIG or other standard finishes.

Czech name

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Czech description

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Type

J_SC - Article in a specialist periodical, which is included in the SCOPUS database

CEP classification

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OECD FORD branch

20501 - Materials engineering

Project

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Continuities

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2023

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Applied Surface Science Advances

ISSN

2666-5239

e-ISSN

2666-5239

Volume of the periodical

18

Issue of the periodical within the volume

100483

Country of publishing house

NL - THE KINGDOM OF THE NETHERLANDS

Number of pages

9

Pages from-to

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UT code for WoS article

001113572400001

EID of the result in the Scopus database

2-s2.0-85178932393