Influence of Intermetallic Compounds Growth on Properties of Lead-free Solder Joints

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F12%3A43925000" target="_blank" >RIV/49777513:23220/12:43925000 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1109/ISSE.2012.6273075" target="_blank" >http://dx.doi.org/10.1109/ISSE.2012.6273075</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2012.6273075" target="_blank" >10.1109/ISSE.2012.6273075</a>

Result language
angličtina
Original language name
Influence of Intermetallic Compounds Growth on Properties of Lead-free Solder Joints
Original language description
This article deals with the growth of intermetallic compounds (IMCs) in solder joints and influence of these IMCs on properties of soldered joints. The test specimens of printed circuit boards (PCBs) with different surface finishes were made for this experiment. Tin_G (galvanic tin), Tin_C (immersion tin), Cu (pure copper), OSP (organic solderability preservative) and ENIG (electroless nickel immersion gold) surface finishes were chosen. The soldered joints were created on the test specimens by reflow soldering process. The surface mount solder joints of LCCC resistor of size 1206 were studied. Two lead-free solder paste and one tin-lead solder paste were chosen for research of IMCs and their influence on properties of soldered joints. The test specimens were exposed to elevated aging for research of IMCs growth in solder joint. The specimens were thermal stressed in hot air oven at the temperature of 150°C for a periods of 0, 1, 2, 4, 8, and 16 days. The shear test was used for resear
Czech name
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Czech description
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Project
<a href="/en/project/ED2.1.00%2F03.0094" target="_blank" >ED2.1.00/03.0094: Regional Innovation Centre for Electrical Engineering (RICE)</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
35 th International Spring Seminar on Electronics Technology - Power Electronics
ISBN
978-1-4673-2240-9
ISSN
2161-2528
e-ISSN
—
Number of pages
5
Pages from-to
213-217
Publisher name
Vienna University of Technology, Austria
Place of publication
Vienna
Event location
Bad Aussee, Austria
Event date
May 9, 2012
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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