Thermo-Mechanical Test of SnBi and SnCu Solder Joints on Different Surface Finishes
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00338231" target="_blank" >RIV/68407700:21230/19:00338231 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE.2019.8810299" target="_blank" >https://doi.org/10.1109/ISSE.2019.8810299</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2019.8810299" target="_blank" >10.1109/ISSE.2019.8810299</a>
Alternative languages
Result language
angličtina
Original language name
Thermo-Mechanical Test of SnBi and SnCu Solder Joints on Different Surface Finishes
Original language description
The article deals with the heating factor influence on the solder joint reliability. A specific goal was to reveal the influence of the heating factor on the thickness of the Intermetallic Layer (IML) for Copper, Electroless Nickel Immersion Gold (ENIG) and Hot Air Solder Levelling (HASL) surface finishes and two lead free solders Sn42Bi58 and Sn99.3Cu0.7. Three different heating factors were used for hot air reflow of the Bismuth solder paste and another three for reflow of the SnCu solder paste. Micro-sections were prepared and the IMC (Inter-Metallic Compound) layer thickness was measured. The manufactured samples were subjected to destructive shear strength testing at laboratory temperature (20 degrees C) and at 65 degrees C. The results show an influence of intermetallic layer thickness on the shear strength and a minor decrease of the shear strength at elevated testing temperature for a low temperature Bismut based solder paste. When SnCu solder was used, the IMC layer was thicker and also the shear strength was lower, in an average (on all surface finishes) by 19%.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
—
OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2019 42nd International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-7281-1874-1
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
4
Pages from-to
—
Publisher name
IEEE Press
Place of publication
New York
Event location
Wroclaw
Event date
May 15, 2019
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000507501000071