INFLUENCE OF REFLOW TEMPERETURE PROFILE ON THE MECHANICAL PROPERTIES OF SOLDER JOINTS
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F16%3A00306400" target="_blank" >RIV/68407700:21230/16:00306400 - isvavai.cz</a>
Result on the web
<a href="http://czech.imapseurope.org/index.php/imaps-flash-conference" target="_blank" >http://czech.imapseurope.org/index.php/imaps-flash-conference</a>
DOI - Digital Object Identifier
—
Alternative languages
Result language
angličtina
Original language name
INFLUENCE OF REFLOW TEMPERETURE PROFILE ON THE MECHANICAL PROPERTIES OF SOLDER JOINTS
Original language description
A temperature profile has an impact on the final quality of the solder joints. It is important from the perspective of proper reflow of the solder alloy, the correct activation of the flux and not exceeding the maximum recommended temperature resistance of the components and PCB. Additionally the temperature profile has a significant influence on the formation of intermetallic compounds. The thickness of intermetalic layers depends on the heating factor – amount of heat after the moment when the solder alloy is already in the liquid state. This article compares mechanical properties of two solder pastes based on SnCu and SnBi regarding to the different temperature profiles. The passivated copper and ENIG were used as surface finishes of soldering pads. Comparison of mechanical properties was based on the shear test respectively on the pull-off force. The results shows that the shape of temperature profile, respectively the heating factor has the influence on the mechanical maximum pull-off force and thus on the mechanical properties of solder joints.
Czech name
—
Czech description
—
Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
—
Result continuities
Project
—
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2nd Flash Conference 2016, Book of Abstracts
ISBN
978-80-214-5416-3
ISSN
—
e-ISSN
—
Number of pages
5
Pages from-to
—
Publisher name
CEITEC - Central European Institute of Technology
Place of publication
Brno
Event location
Brno University of Technology, FEEC
Event date
Nov 3, 2016
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
—