Released of Latent Heat from Solder Joints to Surrounding during Solidification of Solder Alloy - Experimental Study
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00338284" target="_blank" >RIV/68407700:21230/19:00338284 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE.2019.8810199" target="_blank" >https://doi.org/10.1109/ISSE.2019.8810199</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2019.8810199" target="_blank" >10.1109/ISSE.2019.8810199</a>
Alternative languages
Result language
angličtina
Original language name
Released of Latent Heat from Solder Joints to Surrounding during Solidification of Solder Alloy - Experimental Study
Original language description
The thermal behavior of solder alloys during melting and solidification is important from point of many aspects. It has influence on formation of joint structure together with intermetallic compounds, reliability issues like tombstoning effect or warpage effect, dimensional changes of components and printed circuit board etc. This article deals with influence of released latent heat from solder joints on the surrounding temperature. Printed circuit boards with soldering pads designed side by side in the matrix and solder paste based on SAC387 solder alloy particles was used in experimental study. The influence of increased number of solder joints in a defined area was examined. The temperature profiles were measured below soldering pads during reflow soldering to find the thermal influences. The results show that released latent heat from solder joint has influence on surrounding temperature and it can delay the solidification of neighbor joint.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
—
OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2019 42nd International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-7281-1874-1
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
4
Pages from-to
—
Publisher name
IEEE Press
Place of publication
New York
Event location
Wroclaw
Event date
May 15, 2019
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000507501000015