Latent heat induced deformation of PCB substrate: Measurement and simulation

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F22%3A00358666" target="_blank" >RIV/68407700:21230/22:00358666 - isvavai.cz</a>

Result on the web

<a href="https://doi.org/10.1016/j.csite.2022.102173" target="_blank" >https://doi.org/10.1016/j.csite.2022.102173</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.csite.2022.102173" target="_blank" >10.1016/j.csite.2022.102173</a>

Result language

angličtina

Original language name

Latent heat induced deformation of PCB substrate: Measurement and simulation

Original language description

The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 mu m in the place of the heat source and 0.3 mu m in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure.

Czech name

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Czech description

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Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

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OECD FORD branch

20201 - Electrical and electronic engineering

Project

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Continuities

S - Specificky vyzkum na vysokych skolach

Publication year

2022

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Case Studies in Thermal Engineering

ISSN

2214-157X

e-ISSN

2214-157X

Volume of the periodical

36

Issue of the periodical within the volume

102173

Country of publishing house

GB - UNITED KINGDOM

Number of pages

11

Pages from-to

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UT code for WoS article

000813525000008

EID of the result in the Scopus database

2-s2.0-85132173790