Long-term Behavior of IMCs in Lead-free Solder Joints

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F11%3A43898554" target="_blank" >RIV/49777513:23220/11:43898554 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1109/ISSE.2011.6053573" target="_blank" >http://dx.doi.org/10.1109/ISSE.2011.6053573</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2011.6053573" target="_blank" >10.1109/ISSE.2011.6053573</a>

Result language
angličtina
Original language name
Long-term Behavior of IMCs in Lead-free Solder Joints
Original language description
This article deals with the creation and growth of intermetallic compounds (IMCs) in solder joints. The test samples of copper substrate were made for experiment. The soldered joints were created on the test samples by hand soldering proces at the temperature of 250°C. Four lead-free solder alloys and one tin-lead solder alloy were chosen for research of IMCs. The test samples were divided into several groups. These groups differ in two parameters. The first parameter is soldering process. Half of the samples were soldered for a period of 10 s and the second half of samples were soldered for a period of 60 s. The second parameter is thermal stress. The test samples were exposed to elevated aging for research of long-term behavior of IMCs in solder joint. The samples were thermal stressed in hot air oven at the temperature of 150°C for a periods of 4, 8, 12, 16 and 20 weeks. The results of analysis of IMCs in solder joints using confocal and metallographic microscopes will be presented
Czech name
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Czech description
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Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)<br>S - Specificky vyzkum na vysokych skolach

Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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