Surface Roughness Influence on Solderability

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F09%3A00501574" target="_blank" >RIV/49777513:23220/09:00501574 - isvavai.cz</a>
Result on the web
—
DOI - Digital Object Identifier
—

Result language
angličtina
Original language name
Surface Roughness Influence on Solderability
Original language description
The article deals with results of solderability testing of printed circuit boards. The wetting balance test was used for solderability testing. This test makes wetting force measurement possible as a function of time. Measured values are recorded automatically. Surface roughness is one of parameters, which influence surface wetting. The article will present the results and comparison of tested printed circuit boards with different surface roughness. This comparison will be made for several surface finish types. Test specimens of printed circuit boards with surface finishes SnG (galvanic tin), SnC (immersion tin), Cu (pure copper), OSP (organic solderability preservative) and ENIG (electroless nickel immersion gold) were tested. The test specimens werepurposely roughened by different abrasive paper before solderability testing. Roughness created on surface finishes were oriented vertically and horizontally.
Czech name
—
Czech description
—

Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
International Spring Seminar on Electronics Technology
ISBN
978-1-4244-4260-7
ISSN
—
e-ISSN
—
Number of pages
6
Pages from-to
—
Publisher name
IEEE
Place of publication
Piscataway
Event location
Brno
Event date
May 17, 2009
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
—

Similar results(10)