Double-sided Preheating Influence on Solderability

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F08%3A00500315" target="_blank" >RIV/49777513:23220/08:00500315 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Double-sided Preheating Influence on Solderability

Original language description

Paper deals with results of solderability testing of Printed Circuit Boards (PCBs). For measurement was used one of the solderability evaluation methods known as the wetting balance test. The wetting balance test measures the wetting forces imposed by the molten solder on the test surface as it is dipped into and held in the solder bath as a function of time. Paper will present the comparison of results of printed circuit board solderability test with preheating in agreement with IPC/EIA J-STD-003A, with IEC 60068-2-54 and with hot air double-sided preheating. This comparison will be also made for several lead-free surface finish types. It was tested printed circuit board coupons with surface finishing of galvanic tin, immersion tin, ENIG (electrolessnickel immersion gold), OSP (organic solderability preservative) and pure copper.

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

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Continuities

Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year

2008

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

ISSE 2008

ISBN

978-1-4244-3973-7

ISSN

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e-ISSN

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Number of pages

6

Pages from-to

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Publisher name

IEEE

Place of publication

New York

Event location

Budapešť

Event date

Jan 1, 2008

Type of event by nationality

WRD - Celosvětová akce

UT code for WoS article

000272337900079