Influence of PCB Surface Finishes on Intermetallic Compound Growth

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F22%3A43965444" target="_blank" >RIV/49777513:23220/22:43965444 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9812788" target="_blank" >https://ieeexplore.ieee.org/document/9812788</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE54558.2022.9812788" target="_blank" >10.1109/ISSE54558.2022.9812788</a>

Result language
angličtina
Original language name
Influence of PCB Surface Finishes on Intermetallic Compound Growth
Original language description
This article presents research focused on the intermetallic compound growing under different conditions. The quality of solder joints depends on many factors, one of which is the thickness of the intermetallic layer and its composition. Combination of multiple reflow processes which is common during the production process and thermal aging you can simulate long-term use of the product, which makes it possible to determine the condition of solder joints in the future. The growth of intermetallic layers using thermal aging is known, but the demand for lead-free solder causes new alloys with unknown properties. Each element in the solder alloy has a different impact on the resulting solder properties. The formation of intermetallic layers also depends on the surface finishes of the pads, so the object of the experiment is to compare the effect of known and used SAC305 solder with solder doped by Ge or Co at the various finishes of pads.
Czech name
—
Czech description
—

Project
<a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2022
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2022 45th International Spring Seminar on Electronics Technology : /proceedings/
ISBN
978-1-66546-589-2
ISSN
2161-2536
e-ISSN
2161-2536
Number of pages
6
Pages from-to
1-6
Publisher name
IEEE
Place of publication
Piscaway
Event location
Vienna, Austria
Event date
May 11, 2022
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000853642200035

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