Influence Of Thermal Aging On Intermetallic Compound Growth In Solder Alloys

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F22%3A43966049" target="_blank" >RIV/49777513:23220/22:43966049 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9905224" target="_blank" >https://ieeexplore.ieee.org/document/9905224</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/Diagnostika55131.2022.9905224" target="_blank" >10.1109/Diagnostika55131.2022.9905224</a>

Result language
angličtina
Original language name
Influence Of Thermal Aging On Intermetallic Compound Growth In Solder Alloys
Original language description
This article will present the influence of thermal aging and the reflow cycle numbers on intermetallic layer growth. Search for the new soldering alloy brings a new and different combination of elements, which behave differently in work conditions. The objects of the experiment are five types of solder alloys, the referential alloy is SAC compared to SnNi based solder alloys combined with germanium, cobalt, phosphor, and copper elements. The results of the experiment will be the thickness of intermetallic layers between the copper pad and solder alloys in different combinations of thermal aging and reflow cycles. Values will be supported by the elemental analysis by the electron microscope using an EDS (Energy-dispersive X-ray spectroscopy) analysis. More details about the solder alloys and settings reflow and aging processes will be presented in the paper.
Czech name
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Czech description
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Project
<a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2022
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the 2022 International Conference on Diagnostics in Electrical Engineering (Diagnostika) : CDEE 2022
ISBN
978-1-66548-082-6
ISSN
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e-ISSN
2464-708X
Number of pages
5
Pages from-to
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Publisher name
University of West Bohemia in Pilsen
Place of publication
Pilsen
Event location
Pilsen, Czech Republic
Event date
Sep 6, 2022
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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