Influence of Latent Heat on the Shape of Temperature Profile for Different Types of Solder Alloys
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F16%3A10328839" target="_blank" >RIV/00216208:11320/16:10328839 - isvavai.cz</a>
Alternative codes found
RIV/68407700:21230/16:00303325
Result on the web
<a href="http://dx.doi.org/10.1109/ISSE.2016.7563191" target="_blank" >http://dx.doi.org/10.1109/ISSE.2016.7563191</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2016.7563191" target="_blank" >10.1109/ISSE.2016.7563191</a>
Alternative languages
Result language
angličtina
Original language name
Influence of Latent Heat on the Shape of Temperature Profile for Different Types of Solder Alloys
Original language description
Temperature profile is a very important parameter which has a high impact on reliability issues in electronic assembly manufacturing. The wrong shape of temperature profile (temperature/cooling gradients, maximum temperature, preheat together with flux activation) can lead to issues like flux/solder spattering, pad cratering, unwetting, excessive interrmetallic growth, tombstone effect shrinkage etc. This article deals with influence of latent heat on the shape of temperature profile, which starts to be more attractive due to higher integrity of electronics equipment. The experiments were based of two lead-free solder alloys (Sn96.5Ag3.5, Sn96.5Ag3Cu0.5), which were remelted on the copper pads in continual convection furnace. The temperature profile, were measured directly under the copper pads. Results shows, that the measured temperature profiles under soldering pads differs against the temperature profile which were measured on the PCB. Additionally the temperature profiles which were measured under soldering pads differ according to used solder alloys as well.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/LM2011025" target="_blank" >LM2011025: MLTL - Magnetism and Low Temperature Laboratories - operation and development of national research infrastructure</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2016 39TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE)
ISBN
978-1-5090-1389-0
ISSN
2161-2536
e-ISSN
—
Number of pages
4
Pages from-to
214-217
Publisher name
IEEE
Place of publication
NEW YORK
Event location
Pilsen
Event date
May 18, 2016
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000387089800042