Chemical bonds in intercalation compounds CuxTiCh2 (Ch = S, Te)

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F19%3A10406623" target="_blank" >RIV/00216208:11320/19:10406623 - isvavai.cz</a>
Result on the web
<a href="https://verso.is.cuni.cz/pub/verso.fpl?fname=obd_publikace_handle&handle=fNIRJob.lL" target="_blank" >https://verso.is.cuni.cz/pub/verso.fpl?fname=obd_publikace_handle&handle=fNIRJob.lL</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1063/1.5128299" target="_blank" >10.1063/1.5128299</a>

Result language
angličtina
Original language name
Chemical bonds in intercalation compounds CuxTiCh2 (Ch = S, Te)
Original language description
A thorough study of the chemical bonding between intercalated copper and host lattice TiCh2 (Ch = S, Te) was performed. In order to separate the contributions of the copper, titanium, and chalcogen states into the electronic structure of the valence band, photoelectron spectroscopy in nonresonant and resonant (Cu 3p-3d and Ti 2p-3d) excitation modes was used. It is shown that the ionicity of the chemical bond between copper and host lattice is decreased in the TiS2 RIGHTWARDS ARROW TiSe2 => TiTe2 row. In CuxTiS2, copper atoms form the chemical bond with TiCh2 host lattice, while in CuxTiTe2 directly with tellurium atoms.
Czech name
—
Czech description
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Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
—
OECD FORD branch
10305 - Fluids and plasma physics (including surface physics)

Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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