Interaction of Cu, Sn, and Ag nano-powders with Cu substrate

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216224%3A14310%2F09%3A00049594" target="_blank" >RIV/00216224:14310/09:00049594 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Interaction of Cu, Sn, and Ag nano-powders with Cu substrate
Original language description
The contribution deals with nano-particles and raised from selected pure metals (Cu, Ag, Sn). The temperature behaviours of these powders under inert atmosphere and under reactive gas are studied as well as the particles / Cu substrate systems. The measurements of the thermal stability of the metal particles were obtained using DSC. It enables to evaluate heat effects of oxidation process, sintering, solid and liquid temperatures. The Cu-substrate / metal powder interlayer / Cu-substrate sandwich samples were also investigated experimentally using DSC technique. This experiment simulates real soldering process using sandwich samples inside DSC. The microstructure and phase compositions of the samples obtained in consequence of different temperature/rate/atmosphere conditions inside DSC were investigated. The samples were investigated: microstructure, porosity, phase composition, diffusion profiles, etc. (SEM, WDX, TEM). The CALPHAD approach was used for the phase diagram calculations.
Czech name
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Czech description
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Project
<a href="/en/project/GA106%2F09%2F0700" target="_blank" >GA106/09/0700: Thermodynamics and microstructure of environmentally friendly nanoparticle solders</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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