Lokalization of cyclic plastic deformation in ultra-fine grained copper

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26210%2F09%3APU79091" target="_blank" >RIV/00216305:26210/09:PU79091 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
čeština
Original language name
Lokalizace cyklické plastické deformace v ultrajemnozrnné mědi
Original language description
The paper is devoted to fatigue behavior of ultrafine grained Cu under cycling with tensile mean stress. Cyclic creep curve was experimentally determined. Surface relief, crack initiation and strain localization into cyclic slip bands were observed by SEM. The ultrafine grained structure was analyzed by means of EBSD. It has been found that the cycling with high tensile mean stress does not influence the ultrafine grained structure. No grain coarsening was observed.
Czech name
Lokalizace cyklické plastické deformace v ultrajemnozrnné mědi
Czech description
The paper is devoted to fatigue behavior of ultrafine grained Cu under cycling with tensile mean stress. Cyclic creep curve was experimentally determined. Surface relief, crack initiation and strain localization into cyclic slip bands were observed by SEM. The ultrafine grained structure was analyzed by means of EBSD. It has been found that the cycling with high tensile mean stress does not influence the ultrafine grained structure. No grain coarsening was observed.

Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
SEMDOK 2009, 14th International of PhD. students' seminar
ISBN
978-80-8070-959-4
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
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Publisher name
EDIS - Žilina University publisher
Place of publication
Žilina
Event location
Žilina - Súĺov
Event date
Jan 29, 2009
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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