Microstructure of ultra-fine grained Cu by UHV SLEEM

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26210%2F09%3APU83814" target="_blank" >RIV/00216305:26210/09:PU83814 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Microstructure of ultra-fine grained Cu by UHV SLEEM
Original language description
Ultra-fine grained (UFG) materials belong nowadays to front line areas of research in material sciences. The UFG structure can be obtained by means of the equal channel angular pressing (ECAP). We report on study of the grain structure in ECAPed copper using the cathode lens equipped ultrahigh vacuum scanning low energy electron microscope (UHV SLEEM). The grain contrast was found achieving its maximum at electron energies below about 30 eV where it exhibited dependence on electron energy specific for the grain orientation. The energy dependence of the slow electron reflectance seemed to be capable of serving as a fingerprint enabling determination of the crystalline orientation. The very low energy electron reflectance might become an alternative to the electron backscatter diffraction method owing to its high resolution and fast data acquisition.
Czech name
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Czech description
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Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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