Multi Substrate Modules ? Cheap Solution for 3D Packaging

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F02%3APU29309" target="_blank" >RIV/00216305:26220/02:PU29309 - isvavai.cz</a>
Result on the web
—
DOI - Digital Object Identifier
—

Result language
angličtina
Original language name
Multi Substrate Modules ? Cheap Solution for 3D Packaging
Original language description
The stacked packages are one of the most significant advances for building modern electronic systems. They give a good opportunity to built high volume three-dimensional devices with requested quality. 3D packages deliver volumetric density through vertical stacking. This method integrates multiple substrates and chips in a package to provide higher levels of functionality that can be achieved through multiple package solutions technologies. The aim of this paper is to describe and discuss some of the possible solutions, which are currently followed by research project of the Czech Ministry of Education in the frame of Research Plan MSM 262200022 ?MIKROSYT Microelectronic Systems and Technologies?, and at the same time by the Grant project FRVS IS 421920 ?Innovation of Education of Microelectronics Assembly Technologies?.
Czech name
—
Czech description
—

Publication year
2002
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of The IMAPS Nordic Annual Conference Stockholm, 2002
ISBN
951-98002-4-7
ISSN
—
e-ISSN
—
Number of pages
122
Pages from-to
114-235
Publisher name
Pelkosen Painotuote
Place of publication
Kiiminki, Finland
Event location
Stockholm
Event date
Sep 29, 2002
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
—

Similar results(10)