MSM realized by Thick Film Technology

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F02%3APU29215" target="_blank" >RIV/00216305:26220/02:PU29215 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

MSM realized by Thick Film Technology

Original language description

Multi Substrate Modules (MSM) are constructed as the stacked packages. One of themost significant advances is high flexibility and possibility to build a cheap electronic system. They give a good ooportunity to construct high volume three-dimensional devices with requested quality. 3D packages deliver volumetric density through vertical stacking. This method integrates multiple substrates and chips in a package to provide higher levels of functionality than can be achieved through multiple package soluttions technologies. To describe and discuss some of the possible ways is the aim of this article.

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

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Continuities

Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year

2002

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

ELECTRONIC DEVICES AND SYSTEMS 02 - PROCEEDINGS

ISBN

80-214-2180-0

ISSN

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e-ISSN

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Number of pages

5

Pages from-to

211-215

Publisher name

Vysoké učení technické v Brně

Place of publication

Brno

Event location

Brno

Event date

Sep 9, 2002

Type of event by nationality

EUR - Evropská akce

UT code for WoS article

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