On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F11%3APU93661" target="_blank" >RIV/00216305:26220/11:PU93661 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6053560" target="_blank" >http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6053560</a>
DOI - Digital Object Identifier
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Result language
angličtina
Original language name
On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers
Original language description
This paper describes design, construction and some recent tests of three dimensional stacked structures. These structures have great potential to realize compact structures combining multiple different applications in one package. Interconnections used in these structures pay important role in packaging. They not only provide electrical connection, but they also act as mechanical attachment between substrates and are supposed to be reliable. Approach mentioned in this paper might lead to increase of reliability of 3D interconnections. Goal of this work is development and implementation of reliable 3D stacked structures, where LTCC, Al2O3 and also flexible substrates can be connected together in one package by interconnections that are based on vacuum evaporated and galvanically reinforced conductive layers of several types - fixed planar and elastic ones, both in connection with solder balls.
Czech name
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Czech description
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Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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