3D LTCC and Flexible Structure Interconnections Based on Galvanized Layers

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F11%3APU93660" target="_blank" >RIV/00216305:26220/11:PU93660 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=6142406&url=http%3A%2F%2Fieeexplore.ieee.org%2Fxpls%2Fabs_all.jsp%3Farnumber%3D6142406" target="_blank" >http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=6142406&url=http%3A%2F%2Fieeexplore.ieee.org%2Fxpls%2Fabs_all.jsp%3Farnumber%3D6142406</a>
DOI - Digital Object Identifier
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Result language
angličtina
Original language name
3D LTCC and Flexible Structure Interconnections Based on Galvanized Layers
Original language description
Interconnections have an important role in packaging as they not only provide electrical connection but they also act as mechanical attachment between connected substrates and are supposed to be as reliable as possible. This paper describes design, construction and some recent laboratory tests of 3D stacked structures, where different materials with different coefficient of thermal expansion are combined together in one package. Goal of this work is to develop reliable 3D stacked structure intercronnection method, which will allow connection between LTCC, Al2O3 and also flexible substrates.
Czech name
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Czech description
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Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)<br>S - Specificky vyzkum na vysokych skolach

Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of 18th European microelectronics packaging conference EMPC 2011
ISBN
978-0-9568086-0-8
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
358-361
Publisher name
IMAPS-Europe
Place of publication
Brighton, UK
Event location
Brighton
Event date
Sep 12, 2011
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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