Zero Shrink LTCC 3D Structure Interconnections

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F12%3APU99452" target="_blank" >RIV/00216305:26220/12:PU99452 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Zero Shrink LTCC 3D Structure Interconnections
Original language description
This paper describes design, construction and some recent tests of three dimensional stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting zero shrink Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching.
Czech name
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Czech description
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Project
<a href="/en/project/ED1.1.00%2F02.0068" target="_blank" >ED1.1.00/02.0068: Central european institute of technology</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2012 35th International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-4673-2241-6
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
128-132
Publisher name
IEEE Xplore digital library
Place of publication
Vienna University of Technology Gusshausstrasse
Event location
Bad Aussee
Event date
May 9, 2012
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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