PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F12%3APU100999" target="_blank" >RIV/00216305:26220/12:PU100999 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS
Original language description
This paper describes design, construction and also some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting zero shrink Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Electronics Devices and Systems 2012
ISBN
978-80-214-4539-0
ISSN
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e-ISSN
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Number of pages
6
Pages from-to
245-251
Publisher name
Ing. Vladislav Novotný - Litera
Place of publication
Tabor 43a,612 00 Brno
Event location
Brno
Event date
Jun 28, 2012
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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