New Facts from lead-free Solders Reliability Investigation

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F09%3APU83364" target="_blank" >RIV/00216305:26220/09:PU83364 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
New Facts from lead-free Solders Reliability Investigation
Original language description
There are done many research works following investigation of lead-free solders, and differently results are achieved for identical solder materials. The reason is simple, the same solder compound can show diverse results when other material and processparameters are different. That is reason why we have addicted on investigation of some critical areas which has significant impact on solder joint reliability and lifetime. At length the soldering area should be divided in three principal parts that arematerials and components, process and equipments, and design and testing. Our actual research work at Brno University of Technology is focused on soldering process parameters impact on solder joint structure, on wetting angle changes in dependence on material/process parameters and on thermo mechanical strain of soldered joints.
Czech name
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Czech description
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Project
<a href="/en/project/GA102%2F09%2F1701" target="_blank" >GA102/09/1701: Research and Development of the New Soldering Principles for Increasing of Solder Joints Reliability</a><br>
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
17th European Microelectronics and Packaging Conference
ISBN
978-1-4244-4722-0
ISSN
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e-ISSN
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Number of pages
6
Pages from-to
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Publisher name
IMAPS Italy
Place of publication
Rimini, Italy
Event location
Rimini
Event date
Jun 15, 2009
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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