Design, modeling and fabrication of novel MEMS structure utilizing carbon nanotubes
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F11%3APU93554" target="_blank" >RIV/00216305:26220/11:PU93554 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Design, modeling and fabrication of novel MEMS structure utilizing carbon nanotubes
Original language description
The paper deals with novel Micro-Electro-Mechanical System (MEMS) structure. The structure was designed to be utilized as capacitance pressure sensor. The most applicable topology of the MEMS structure was selected by means of electrostatic model analysis made by MatLAB software. There were proposed five structures and the best solution was selected as the chessboard structure, since it provides the suitable capacity for the sensor measurement range. The overall capacity and also sensitivity of the MEMSsensor was increased by means of carbon nanotubes (CNTs). Therefore the pressure measurement range increased as well. The comparison between conventional capacitance sensor structures and the presented proposal shown, that the improvement depends on thearea and number of the growing fields. However this improvement is from tens to hundereds of percents. The article depicts the design process including simulations and analysis of the chosen structure too.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of 18th European microelectronics packaging conference EMPC 2011
ISBN
978-0-9568086-0-8
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
79-83
Publisher name
Neuveden
Place of publication
Brighton
Event location
Brighton
Event date
Sep 12, 2011
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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