Recent advance in solder ball interconnections reliability examination
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F11%3APU94527" target="_blank" >RIV/00216305:26220/11:PU94527 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6053560" target="_blank" >http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6053560</a>
DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Recent advance in solder ball interconnections reliability examination
Original language description
This article describes recent advance in research of reliability of lead-free (SAC 305) ball interconnections between electronic modules and base printed circuit boards. Alternative methods such as finite element method, which is being widely used in simulation software Ansys and by Coffin-Manson's fatigue model. Recent calculations concur to statistic-based evaluation of earlier experiments, which proved greater reliability of solder joints created on alumina substrates.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)<br>S - Specificky vyzkum na vysokych skolach
Others
Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
ISSE 2011 - PROCEEDINGS
ISBN
978-1-4577-2111-3
ISSN
2161-2528
e-ISSN
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Number of pages
4
Pages from-to
253-257
Publisher name
Technická Univerzita Košice
Place of publication
Košice, SK
Event location
Tatranská Lomnica
Event date
May 11, 2011
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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