The Properties Comparison of Solder Joints on Ceramic and FR-4 Substrates
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F12%3APU101021" target="_blank" >RIV/00216305:26220/12:PU101021 - isvavai.cz</a>
Result on the web
<a href="http://www.estc2012.eu" target="_blank" >http://www.estc2012.eu</a>
DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
The Properties Comparison of Solder Joints on Ceramic and FR-4 Substrates
Original language description
Reliability of electro-technical products is still a highly actual and discussed topic. Every electro-technical product consists not only of the components, functional blocks and systems, but also substrate as printed circuit board (PCB) or ceramic substrates, which are interconnected by solder joints. This article is focuses on a comparison of some properties of solder joints on ceramic and PCB substrates. Standard aluminum oxide ceramics (corundum) with thickness t = 0.65 mm was used as the ceramic substrate. Standard FR-4 board with a thickness t = 1.5 mm was used as the PCB substrate. This paper compares the main strength of solder joint at various concentrations of O2, type solders (SnPb, SnAgCu, ...), the size of components (0402, 0603, 2512, ...) and material surfaces. Shear test equipment DAGE was used to compare the mechanical strength.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/2A-1TP1%2F143" target="_blank" >2A-1TP1/143: Research of novel mechatronic MEMS structures for pressure measurements</a><br>
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
4TH ELECTRONICS SYSTEM INTEGRATION TECHNOLOGIES CONFERENCE ESTC 2012
ISBN
978-1-4673-4644-3
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
1-5
Publisher name
Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium
Place of publication
Amsterdam, NL
Event location
Amsterdam RAI
Event date
Sep 17, 2012
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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