Study of Atmosphere Influence on BGA Solder Balls Process

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F13%3APU104567" target="_blank" >RIV/00216305:26220/13:PU104567 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Study of Atmosphere Influence on BGA Solder Balls Process

Original language description

This article deals with the influence of different atmosphere (normal, vapor, nitrogen) on some mechanical parameters, as shear strength, for BGA solder balls (Sn63Pb37, SAC305). There are also micro-sections of solder balls studied. Main objective of this work is to establish the optimal and necessary concentration of nitrogen for each application.

Czech name

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Czech description

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Type

J_x - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

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Continuities

S - Specificky vyzkum na vysokych skolach

Publication year

2013

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Electronics Technology (ISSE), 2011 34th International Spring Seminar on Electronics

ISSN

2161-2528

e-ISSN

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Volume of the periodical

36

Issue of the periodical within the volume

2013

Country of publishing house

SK - SLOVAKIA

Number of pages

6

Pages from-to

121-126

UT code for WoS article

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EID of the result in the Scopus database

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