Optimizing of PCBA cleaning process through process calibration tools
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F13%3APU106859" target="_blank" >RIV/00216305:26220/13:PU106859 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6698652" target="_blank" >http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6698652</a>
DOI - Digital Object Identifier
—
Alternative languages
Result language
angličtina
Original language name
Optimizing of PCBA cleaning process through process calibration tools
Original language description
The paper explores complex interactions between chemistry, mechanics and thermodynamic parameters involved in the water based PCBA cleaning process. Current complexity of PCB assemblies, together with the needs to clean flux residues with the high gradeof polymerization, due to higher soldering temperatures, requires a new approach in design of cleaning systems.
Czech name
—
Czech description
—
Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
—
Result continuities
Project
<a href="/en/project/TA01011754" target="_blank" >TA01011754: New methods of cleaning electronic assemblies with enhanced effectivity, lower impact to the environment and lower energy needs.</a><br>
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2013
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
EMPC 2013
ISBN
978-2-9527467-1-7
ISSN
—
e-ISSN
—
Number of pages
4
Pages from-to
1-3
Publisher name
IEEE
Place of publication
Grenoble. France
Event location
Grenoble
Event date
Sep 9, 2013
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
—