Optical method for validation of changes in the cleaning process and cleaning process optimization

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F19%3APU134779" target="_blank" >RIV/00216305:26220/19:PU134779 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/8951759" target="_blank" >https://ieeexplore.ieee.org/document/8951759</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.23919/EMPC44848.2019.8951759" target="_blank" >10.23919/EMPC44848.2019.8951759</a>

Result language
angličtina
Original language name
Optical method for validation of changes in the cleaning process and cleaning process optimization
Original language description
Currently, electronic assemblies are more complex and compact. Requirements on the reliability of electronic assemblies in a harsh environment are rapidly growing. Assemblies become dense, with small distances between poles. Processing of low and very high-frequency signals requires high values of surface insulation. Experiences confirm that using No-clean soldering technology has only limited efficiency in protection against leakage current, ion migration, and corrosion.
Czech name
—
Czech description
—

Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
ISBN
978-0-9568086-6-0
ISSN
—
e-ISSN
—
Number of pages
8
Pages from-to
1-8
Publisher name
IMAPS Europe
Place of publication
Pisa
Event location
Pisa
Event date
Sep 16, 2019
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000532694100007

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