Connection of electronic and microelectronic modules

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F14%3APU109187" target="_blank" >RIV/00216305:26220/14:PU109187 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1108/MI-10-2013-0053" target="_blank" >http://dx.doi.org/10.1108/MI-10-2013-0053</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1108/MI-10-2013-0053" target="_blank" >10.1108/MI-10-2013-0053</a>

Result language
čeština
Original language name
Connection of electronic and microelectronic modules
Original language description
The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented.
Czech name
Connection of electronic and microelectronic modules
Czech description
The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented.

Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
—
OECD FORD branch
20201 - Electrical and electronic engineering

Publication year
2014
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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