Detection of Defects on BGA Solder Balls Using 2D and 3D Methods
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F15%3APU115765" target="_blank" >RIV/00216305:26220/15:PU115765 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/7247999" target="_blank" >https://ieeexplore.ieee.org/document/7247999</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2015.7247999" target="_blank" >10.1109/ISSE.2015.7247999</a>
Alternative languages
Result language
angličtina
Original language name
Detection of Defects on BGA Solder Balls Using 2D and 3D Methods
Original language description
The paper is focused on non-destructive X-Ray method used for detection of defects on BGA solder balls. It is possible to use 2D or 3D methods with imaging of individual layers. 2D method is faster and it is used in daily basis. 3D method is less common and it is used for unique defects for further examination. This paper deals with using these methods especially throughout rework process.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2015
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Novel Trends in Electronic Manufacturing - Book of Abstracts 38th International Spring Seminar on Electronics Technology
ISBN
978-963-313-177-0
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
245-249
Publisher name
Budapest University of Technology and Economics
Place of publication
Hungary
Event location
Eger
Event date
May 6, 2015
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000374113000050