Electrothermal simulation of bonding wire degradation under uncertain geometries

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F16%3APU118996" target="_blank" >RIV/00216305:26220/16:PU118996 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/7459510" target="_blank" >https://ieeexplore.ieee.org/document/7459510</a>
DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Electrothermal simulation of bonding wire degradation under uncertain geometries
Original language description
In this paper, electrothermal field phenomena in electronic components are considered. This coupling is tackled by multiphysical field simulations using the Finite Integration Technique (FIT). In particular, the design of bonding wires with respect to thermal degradation is investigated. Instead of resolving the wires by the computational grid, lumped element representations are introduced as point-to-point connections in the spatially distributed model. Fabrication tolerances lead to uncertainties of the wires' parameters and influence the operation and reliability of the final product. Based on geometric measurements, the resulting variability of the wire temperatures is determined using the stochastic electrothermal field-circuit model.
Czech name
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Czech description
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Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2016 Design, Automation & Test in Europe Conference & Exhibition (DATE)
ISBN
978-3-9815370-6-2
ISSN
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e-ISSN
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Number of pages
6
Pages from-to
1297-1302
Publisher name
IEEE
Place of publication
Dresden, Germany
Event location
Drážďany
Event date
Mar 14, 2016
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000382679200240

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