STREAMLINING THE PROCESS OF CLEANING PCB AFTER REMOVING BGA

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F16%3APU119826" target="_blank" >RIV/00216305:26220/16:PU119826 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
čeština
Original language name
STREAMLINING THE PROCESS OF CLEANING PCB AFTER REMOVING BGA
Original language description
This paper deals with issues connected with solder residues cleaning process of modern BGA packages. First part is focused on contact cleaning method of solder residues. It describes main disadvantages and incurred defects of this method. Second part is focused on a new contactless cleaning method with special tool and then suggests variety of verification possibilities.
Czech name
STREAMLINING THE PROCESS OF CLEANING PCB AFTER REMOVING BGA
Czech description
This paper deals with issues connected with solder residues cleaning process of modern BGA packages. First part is focused on contact cleaning method of solder residues. It describes main disadvantages and incurred defects of this method. Second part is focused on a new contactless cleaning method with special tool and then suggests variety of verification possibilities.

Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the 22nd Conference Student EEICT 2016
ISBN
978-80-214-5350-0
ISSN
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e-ISSN
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Number of pages
777
Pages from-to
237-239
Publisher name
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Place of publication
Brno
Event location
Brno
Event date
Apr 28, 2016
Type of event by nationality
CST - Celostátní akce
UT code for WoS article
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