PROPER SOLDER PROFILE SET-UP DUE TO PCB CONTAMINATION REDUCTION

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F14%3A43922238" target="_blank" >RIV/49777513:23220/14:43922238 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

PROPER SOLDER PROFILE SET-UP DUE TO PCB CONTAMINATION REDUCTION

Original language description

This article will present the results of testing of ionic cleanliness of PCB in dependence on a soldering profile. Implementation of lead-free solder alloys changed the soldering process. Higher soldering temperatures are used due to higher melting points of alloys. Therefore it was necessary to use another types of fluxes (mostly with higher activity) in order to remove oxides during the soldering process. Fluxes are more aggressive and their residues after soldering can cause undesired issues in electronic assemblies. The largest database of soldering defects (Soldering Defects Database) states that the influence of fluxes and residues causes a quarter of all defects in soldering. The most common defects are dendrites and corrosion resulting from external influences (increased humidity, temperature, voltage) on active flux residues after the soldering process. These defects can be prevented by implementing of PCB cleaning in the production and measurement of ionic cleanliness. One of the important questions is to determine how to measure board cleanliness reliably and which "clean" PCB can be truly considered as clean. International Standard IPC-TM-650 specifies that the allowable level of PCB pollution after soldering is 1.56 ?g NaCl/cm2, but this standard was published in a time when electronic assemblies did not contain so many components and were not as complicated as it is nowadays. Therefore, it is important to realize whether this value is still suitable for "modern" electronic assemblies.

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

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Continuities

S - Specificky vyzkum na vysokych skolach

Publication year

2014

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

Electronic devices and systems : IMAPS CS international conference : proceedings

ISBN

978-80-214-4985-5

ISSN

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e-ISSN

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Number of pages

6

Pages from-to

54-59

Publisher name

Vysoké učení technické

Place of publication

Brno

Event location

Brno

Event date

Jun 25, 2014

Type of event by nationality

WRD - Celosvětová akce

UT code for WoS article

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